Sensonix can meet your PCB assembly or IC packaging requirements from the design/prototype stage through volume production.

Our PCB manufacturing capabilities are highlighted by world class manufacturing lines. Your product can run on fully automated SMT and Through Hole production lines. And we can provide your product with advanced interconnect, miniaturization, advanced packaging and material and substrate solutions.

Your silicon product finishing is handled by experienced engineers and facilitated by our on-site Class 10K Clean Room. Our back-end wafer processing capabilities include wafer-level probe test, back grind, saw, die sort, package, inspection and test.

Sensonix provides turnkey service from program management & engineering support to assembly, test, and supply chain solutions—and we can drop-ship your finished product. Our purchasing infrastructure coupled with our vast component inventory saves you from dealing with suppliers and long lead times.

Sensonix offers chip-on-board manufacturing for a flexible component mix: bare die, fine pitch wire-bonded die, conventional SMT and flip chip components.