PCB Services

Sensonix’s PCB manufacturing capabilities are highlighted by our world class manufacturing lines. Our ability to run SMT and Through Hole prototypes on the same lines that run volume manufacturing enables design verification and smooth transition to volume production. This process saves time and costs and supports meeting your time-to-market goals.

  • Panasonic MSR-M Chip Shooters
  • Contact 3Z Flexible Placement SMT Machines
  • Speedline MPM Auto Stencil Printers
  • BTU VIP 70 Furnaces
  • Packages Placed: 0402, SOIC,SOT,TSSOP,QFP,QFN, BGA, WLCSP
  • Wave Solder Reflow Systems
  • Cut and Clinch
  • Automated Through Hole Soldering
  • Automated Potting
  • Conformal Coating

Sensonix also provides full turnkey management of both production and prototype projects. Our purchasing infrastructure coupled with our vast inventory of components saves you from dealing with long supply chains and component lead times.



Sensonix PCB lines place components ranging from fine-pitch BGA, QFP, 0402 to flip chip placement. We manufacture efficiently by leveraging demand flow methodology and Kan Ban systems.

Sensonix offers chip-on-board manufacturing processes on a wide range of laminate and ceramic substrates.