Product Fulfillment

With a mix of internal capabilities and external vendor relationships, Sensonix has a range of package and test options that support quantities from engineering samples to high volume production, and sizes from the smallest chip scale packages (CSP) to larger SMT and through-hole packages.

Delivery of engineering samples and low volume production is easily supported by our internal capabilities, such as singulated die testing, wafer probing, wire bonding, epoxy-filled and ceramic package prototyping, chip-on-board and flip chip mounting, and laser ID and serialization marking. We also support long term reliability and burn-in testing.

Utilizing the capabilities of multiple external packaging and production test vendors for higher volumes allows us to provide a variety of package form factors and accommodate a wide range of production requirements.

Once in production, Sensonix provides supply chain management for its customers through product order scheduling, inventory management, and delivery forecasts.