Product Fulfillment

With a mix of internal capabilities and external vendor relationships, Sensonix has a range of package and test options that support quantities from engineering samples to high volume production, and sizes from the smallest chip scale packages (CSP) to larger SMT and through-hole packages.

Delivery of engineering samples and low volume production is easily supported by our internal capabilities, such as singulated die testing, wafer probing, wire bonding, epoxy-filled and ceramic package prototyping, chip-on-board and flip chip mounting, and laser ID and serialization marking. We also support long term reliability and burn-in testing.

Utilizing the capabilities of multiple external packaging and production test vendors for higher volumes allows us to provide a variety of package form factors and accommodate a wide range of production requirements.

Once in production, Sensonix provides supply chain management for its customers through product order scheduling, inventory management, and delivery forecasts.


Sensonix can deliver your design in a manner consistent with your manufacturing flow, from singulated die in waffle packs to high volume tape-and-reel.